Documentation Home Page ARTEMiS Home Page
Pour la documentation en FRANÇAIS, utilisez l'outil de traduction de votre navigateur Chrome, Edge ou Safari. Voir un exemple.

Skip to end of metadata
Go to start of metadata

You are viewing an old version of this page. View the current version.

Compare with Current View Page History

Version 1 Next »

Library

ARTEMiS/SSN/TSB-RD

Blocks

Description

These blocks implement a new generation of Time-Stamped Bridge (TSB) called TSB-RD, RD standing for Real Diodes. These TSB supports interpolation methods of previous generation of TSB. The high-impedance mode and rectifying mode are now implemented with real SPS diode or a combination of SPS switch and thyristors (which are enablable diode in fact). Compared with the previous generation of TSB which implemented high-impedance mode with a zero-current feedback loop, TSB-RD are generally more stable and work with RC snubber of high impedance than previous generation of TSB.

TSB-RD family of blocks is composed of the following 3-phase inverters:

  • 2-level
  • 3-level neutral-point-clamped
  • 3-level T-type

Dead-time support

Like previous generation of TSB, TSB-RD blocks supports dead-time smaller than simulation time step (as opposed to SPS inverter models).

Parallelization capability

The 2-level TSB-RD is also capable of parallel operation with firing delays between stages.

TSB-RD recommended usage with SSN

The TSB-RD are built using real SPS switches, diode and/or thyristor. All 3-phase inverters (2-level, 3-level NPC and 3-level T-type) have 9 internal SPS switches, which is close to the typical limit for pre-calculation methods in real-time systems. The TSB-RD inverters are therefore best used in conjunction with SSN and put each inverter in a unique SSN group.

2-level (left), 3-level NPC(center) and 3-level T-type inverter(right) configurations

Masks

Parameters

Switch conduction resistance (Ohms): the IGBT/GTO/MOSFET conduction resistance in Ohms.

Snubber resistance (ohms): the snubber resistance in ohms.

Snubber Capacitance (F): the snubber capacitance in Farads.

Note: the snubbers are always ‘in circuit’ as they are modeled by SPS components, unlike the previous generation of TSB where snubber was in-circuit only during high-impedance mode.

Active Switch Forward Voltage (3-level NPC only): the IGBT/GTO/MOSFET forward voltage in volts.

Diode Forward Voltage (3-level NPC only): the anti-parallel diode forward voltage in volts.

Parallel TSB option (2-level only): this option enables the TSB-Rd to work in parallel. In that case, the blocks ‘Itotal’ input of all parallel TSB-RD must be fed with the sum of the ‘Iabc’ from all the TSB-RD.

Input and Output signals

Simulink connection points

g: the IGBT/GTO/MOSFET gate input signals. The order of the gate signal for phase A is indicated in Figure 1. Phase B and C are following.

Iabc: the inverter output currents in Ampere.

Itotal: the total of inverter output currents from all parallel inverters. Used only when ‘Parallel TSB option’ is enabled.

Physical Modeling connection points

A,B,C: inverter outputs for phases A,B and C.

V+, Vn, V-: DC-bus connection points. (Vn is the neutral connection point for 3-level inverters only)

Examples

Detailed examples using 2-level, 3-level NPC, and 3-level T-type inverters are available in the ARTEMiS on-line section ‘TSB-RD (New TSB with real-diodes and dead-time support, used with SSN)’.

The 2-level example is used with the ‘parallel TSB option’.

References

C. Dufour, J. Mahseredjian , J. Bélanger, “A Combined State-Space Nodal Method for the Simulation of Power System Transients”, IEEE Transactions on Power Delivery, Vol. 26, no. 2, April 2011 (ISSN 0885-8977), pp. 928-935




  • No labels